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High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X

  • High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X
  • High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X
  • High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X
  • High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X
  • High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X
Place of Origin China
Brand Name HIGH WOOD
Certification AS9001
Model Number HW-HSB-D4-05DM-022X
Minimum Order Quantity 100pcs
Price 10$-150$
Packaging Details Standard export package
Delivery Time 2-9weeks
Payment Terms T/T, L/C, Western Union
Supply Ability 100，000pcs per month

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Product Details
Durability 100,000 Mating Cycles Insertion/Extraction Force 1.5 Ounce Typical Per Contact
Operating Temperature -65° To 125°C Current Rating 2 Amperes Hot Swap 1 Ampere Maximum (load Dependent)
Insulation Resistance 5 Gigaohms Minimum Insulator Liquid Crystal Polymer, 30% Glass Filled
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HSB³ Daughter Board Connector

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HW-HSB-D4-05DM-022X
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Product Description

HW-HSB-D4-05DM-022X

High speed configuration available that allows data rates up to 6.250 Gb/s via 100 ohm matched impedance differential pairs.

• Partially populated standard HDB3 mother board and daugher board bodie

Mates with:
• High Speed Mother Board

 

HSB³ HIGH DENSITY CONNECTOR FEATURES:

• Polarization: “D” shaped design
• Keying: Optional keys offer 36 unique keying combinations
• Guide:Pins Optional guide pins provide additional alignment
• Radial Misalignment:Capable of correcting up to a 020” initial radial misalignment
• Angular Misalignment:Capable of mating with up to a 2° initial angular misalignment
 

How to order: 

1 2 3 4 5 6 7
 

Number of

Differential Pairs

 Differential Signal Brush Wire Plating Termination

Contact

Termination

Finish

 Less Hardware (Purchased separately see pg XX for hardware options)
HSB-D4 -03 D M 02 2 X

 

1. Connector Type

HSB-D4 

Designates High Speed HSB³ Daughter Board

 

2. Number of Contacts

Number

Differential

Pairs

No. Low

Speed

Signals

 Dimension A Dimension C
03 20 1.375 1.075
05 30 1.725 1.425
07 40 2.075 1.775
10 60 2.775 2.475
13 80 3.475 3.175

 

3. Differential Signal

D Standard

 

4. Brush Wire Plating

M 0.000050 Au Min. thick over Nickel
C 0.000020 Au Min. thick over Nickel

 

5. Termination

  Type Stickout (Dim. E)
01 PCB, Straight, .016 Dia 0.090
02 PCB, Straight, .016 Dia 0.120
03 PCB, Straight, .016 Dia 0.150
04 PCB, Straight, .016 Dia 0.180
06 PCB, Straight, .016 Dia 0.300

 

6. Contact Termination Finish

2

Gold plated in accordance with MIL-G-45204, Type II, .000030 Min. thick Gold over .000050 Min.thick Nickel

5

Tin plated in accordance with ASTM B545, .00010 Min. thick  Matte Tin over .00010 Min. thick Nickel

6

 Tin-Lead plated in accordance with SAE-AMS-P-81728, .00010 Min. thick Tin-Lead over .00010 Min. thick Copper

 

7. Hardware
X Less Hardware

 

Product pictures:

High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X 0High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X 1High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X 2High Density & High Speed HSB³ Daughter Board Connector，HW-HSB-D4-05DM-022X 3

 

HDB³ & HSB³ HIGH DENSITY CONNECTOR PERFORMANCE:

 Durability:  100,000 mating cycles
 Insertion/Extraction Force:  1.5 ounce typical per contact
 Operating Temperature:  -65° to 125°C
 Current Rating:

 2 amperes Hot swap 1 ampere maximum (load dependent)
 Insulation Resistance:  5 gigaohms minimum

 Dielectric Withstanding Voltage:

  750 volts, 60 hertz, rms @ Sea Level, 250 volts, 60 hertz, rms @ 70,000 feet elevation
 Solderability:  MIL-STD-202, Method 208
 Salt Fog:  48 Hours IAW MIL-STD-1344, method 1001, test condition B
 Humidity:  IAW MIL-STD-1344, method 1002, type II
 Vibration:  4 hours in each of 3 mutually perpendicular axes IAW MIL STD-1344, method 2005, test condition V, letter H
 Shock:  1 shock along each of three mutually perpendicular axes IAW MIL-STD-1344, method 2004,test condition G
 Data Rate (HSB3 ):

 Capable of up to 6.250 Gbps (consult Amphenol for arrangement)

 

MATERIALS:

Insulator: Liquid crystal polymer, 30% glass filled
Contact: Wire Beryllium copper per ASTM B197; finish is gold per ASTM B488 over nickel per AMS-QQ-N-290
Holder: Brass similar to UNS C33500; available finishes include gold per MIL-G-45204, tin-lead per MIL-P- 81728 or tin per MIL-T-10727 (RoHS Compliant)
Sleeve: Stainless steel per AMS-5514, passivated IAW QQ-P-35 (Daughter board, I/O and Stacker connector)

 

 

 

Tags:

HSB³ Mother Board Connector

HW-HSB-M4-05DM-222X

HSB³ Daughter Board Connector